PRODUCT DATA SHEET

IF-SP316-NR/HT is a solder paste designed to eliminate cleaning without compromising on board cosmetics. The paste has the same chemical and physical characteristics as the IF2005M No-Residue flux and the IF14 No-Clean cored solder. The chemistry becomes totally volatile in the dwell time above reflow. The solderability of the paste is excellent even on OSP copper boards.

IF-SP316-NR/HT has excellent printing characteristics and stencil-life if fresh paste is added frequently. Squeegee pressure and speed depends on the stencil configuration. 

IF-SP316-NR/HT has sufficient tack to work effectively with high speed placement equipment. Expected tack life 8 hours. 

         PHYSICAL PROPERTIES

Standard Alloy

Sn63 (Sn63,Pb37)

Powder mesh size/shape

-325 +500/Spherical

Metal Content

88 %

         Test to ANSI/IPC-SF-818

Results

Copper Mirror

Pass

Corrosion

Pass

Silver Chromate

Pass

SIR  (7 days @ 85°C/85% R.H.)

10¹¹

SAFETY      

See the Material Safety Data Sheet for the appropriate safety procedures.

PACKAGING

Available in 500-Gram cartridges /  500-gram and 1 Kg. jars

STORAGE    

Store in refrigerator at ± 52° F. Shelf life 12 months under previous conditions. 

The information contained herein is offered free of charge for use by technically qualified personnel at their discretion and risk. All information and recommendations contained herein are based on test and data which we believe to be reliable, but the accuracy or completeness is not guaranteed and no warranty of any kind is made with respect hereto.

"Our commitment to quality is our most valuable asset"

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Last updated: November 15, 2010.